Mechanisms for forming micro-electro mechanical device
US9254999B2 · kind B2 · utility
1Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2013 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Dec 27, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0771
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a substrate and a MEMS sensor over the substrate. The MEMS sensor includes a floating heater disposed over the substrate. The MEMS sensor further includes a heat sink disposed over the substrate and at a side of the floating heater, and the heat sink has an air gap with the floating heater. The MEMS sensor further includes a first plurality of vias formed through the heat sink and thermally connected to the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.