Dielectric material with low dielectric loss
US9257212B2 · kind B2 · utility
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Key dates
| Filing date | Mar 18, 2013 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Mar 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/022
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention provides a dielectric material with low dielectric loss. The dielectric material comprises (i) 40˜80 parts by weight of polyphenylene ether resin having a Mw of 1000˜7000, a Mn of 1000˜4000 and Mw/Mn=1.0˜1.8; (ii) 5˜30 parts by weight of bismaleimide resins; and (iii) 5˜30 parts by weight of polymer additives, wherein the dielectric material has Dk of 3.75˜4.0 and Df of 0.0025˜0.0045. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.