Laser annealing device and method
US9257287B2 · kind B2 · utility
0Cited by
9References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 3, 2013 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Jul 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02678
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A laser annealing device for compensating wafer heat maps and its method are disclosed. A laser annealing device comprises a pump laser source array including of a plurality of pump laser sources for irradiating a tunable mask, each pump laser source emitting pump laser, an annealing laser source for emitting annealing laser and irradiating the tunable mask, and a tunable mask for transmitting at least part of the annealing laser after being irradiated by the pump laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.