Method of fabricating a semiconductor package with heat dissipating structure having a deformed supporting portion
US9257311B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2013 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Apr 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a semiconductor package is provided, including: providing a heat dissipating structure having a heat dissipating portion, a deformable supporting portion coupled to the heat dissipating portion, and a coupling portion coupled to the supporting portion; coupling a carrier having a semiconductor element carried thereon to the coupling portion of the heat dissipating structure to form between the carrier and the heat dissipating portion a receiving space for the semiconductor element to be received therein; and forming in the receiving space an encapsulant that encapsulates the semiconductor element. The use of the supporting portion enhances the bonding between the heat dissipating structure and a mold used for packaging, thereby preventing the heat dissipating structure from having an overflow of encapsulant onto an external surface of the heat-dissipating portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.