Integrated heat spreader that maximizes heat transfer from a multi-chip package
US9257364B2 · kind B2 · utility
23Cited by
14References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2012 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Jun 23, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In at least some embodiments, an electronic package to maximize heat transfer comprises a plurality of components on a substrate. A stiffener plate is installed over the components. The stiffener plate has openings to expose the components. A plurality of individual integrated heat spreaders are installed within the openings over the components. A first thermal interface material layer (TIM1) is deposited between the components and the plurality of individual integrated heat spreaders. In at least some embodiments, the thickness of the TIM1 is minimized for the components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.