Substrate structure having component-disposing area and manufacturing process thereof
US9258908B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2013 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Aug 2, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09127
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate structure having a component-disposing area and a process thereof are provided. The substrate structure having a component-disposing area includes a core layer, a first dielectric-layer, a laser-resistant metallic-pattern and a second dielectric-layer. The core layer includes a first surface, a component-disposing area and a patterned metallic-layer disposed on the first surface and including multiple pads, and the pads are located within the component-disposing area. The first dielectric-layer is disposed on the core layer and includes multiple openings to respectively expose the pads. The laser-resistant metallic-pattern is disposed on the first dielectric-layer and surrounds a projection area of the first dielectric-layer which the component-disposing area is orthogonally projected on. The second dielectric-layer is disposed on the first dielectric-layer and covers the laser-resistant metallic-pattern, the second dielectric-layer includes a component-disposing cavity corresponding to the projection area, penetrating through the second dielectric-layer and communicated with the openings to expose the pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.