Chemical mechanical polishing (CMP) composition comprising two types of corrosion inhibitors

US9263296B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Bastian Marten Noller · Lorsch, DE
• Michael Lauter · Mannheim, DE
• Albert Budiman Sugiharto · Mannheim, DE
• Yuzhuo Li
• Kenneth Rushing · Ludwigshafen, DE
• Diana Franz · Kohlhof, DE
• Roland Bohn · Laufenburg (Baden), DE

Key dates

• Filing date: Mar 19, 2012
• Grant date: Feb 16, 2016
• Expiry date: Jun 12, 2032

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09K3/1463
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A chemical-mechanical polishing (“CMP”) composition (P) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of A/-heterocyclic compound as corrosion inhibitor, (C) at least one type of a further corrosion inhibitor selected from the group consisting of: (C1) an acetylene alcohol, and (C2) a salt or an adduct of (C2a) an amine, and (C2b) a carboxylic acid comprising an amide moiety, (D) at least one type of an oxidizing agent, (E) at least one type of a complexing agent, and (F) an aqueous medium.