Discrete semiconductor device package and manufacturing method
US9263335B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2015 |
| Grant date | Feb 16, 2016 |
| Priority date | — |
| Expiry date | Jan 28, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12036
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a discrete semiconductor device package (100) comprising a semiconductor die (110) having a first surface and a second surface opposite said first surface carrying a contact (112); a conductive body (120) on said contact; an encapsulation material (130) laterally encapsulating said conductive body; and a capping member (140, 610) such as a solder cap, a further semiconductor die or a combination thereof in conductive contact with the solder portion, said solder cap extending over the encapsulation material. A further solder cap (150) may be provided over the first surface. A method of manufacturing such a discrete semiconductor device package is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.