Patent · US Active

Method of forming a ring-shaped metal structure

US9263362B2 · kind B2 · utility

0Cited by

5References

9Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Rudolf Lachner · Ingolstadt, DE
Josef Boeck · Putzbrunn, DE
Klaus Aufinger · Ottobrunn, DE
Herbert Knapp · Munich, DE

Key dates

Filing date	Feb 27, 2012
Grant date	Feb 16, 2016
Priority date	—
Expiry date	Jun 6, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method includes providing a first semiconductor chip comprising a ring-shaped metal structure extending along a contour of a first main surface of the semiconductor chip. The method includes encapsulating the first semiconductor chip with an encapsulation body thereby defining a second main surface and depositing a metal layer over the first semiconductor chip and the encapsulation body. A plurality of external contact pads are placed over the second main surface of the encapsulation body, the metal layer electrically coupling at least one external contact pad of the plurality of external contact pads to the ring-shaped metal structure. A seal ring is placed between the ring-shaped metal structure and the contour of the first main surface of the first semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.