Multiple bond via arrays of different wire heights on a same substrate
US9263394B2 · kind B2 · utility
62Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2013 |
| Grant date | Feb 16, 2016 |
| Priority date | — |
| Expiry date | Nov 22, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/386
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus relating generally to a substrate is disclosed. In such an apparatus, a first bond via array has first wires extending from a surface of the substrate. A second bond via array has second wires extending from the surface of the substrate. The first bond via array is disposed at least partially within the second bond via array. The first wires of the first bond via array are of a first height. The second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.