Semiconductor packaging identifier
US9263398B1 · kind B1 · utility
1Cited by
4References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 6, 2015 |
| Grant date | Feb 16, 2016 |
| Priority date | — |
| Expiry date | Apr 6, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Described is a semiconductor package frame including a material comprising wire openings a die-mounting surface area with a die-mounting surface and identification markings included within the die-mounting surface. The identification markings uniquely identify the semiconductor package frame from among other semiconductor package frames comprising different identification markings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.