System and method for an improved fine pitch joint
US9263839B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2013 |
| Grant date | Feb 16, 2016 |
| Priority date | — |
| Expiry date | Apr 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20642
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Presented herein are an interconnect and method for forming the same, the method comprising forming an interconnect on a mounting surface of a mounting pad disposed on a first surface of a first substrate, the interconnect comprising a conductive material, optionally solder or metal, the interconnect avoiding the sides of the mounting pad. A molding compound is applied to the first surface of the first substrate and molded around the interconnect to covering at least a lower portion of the interconnect and a second substrate may be mounted on the interconnect. The interconnect may comprise an interconnect material disposed between a first and second substrate and a molding compound disposed on a surface of the first substrate, and exposing a portion of the interconnect. A sidewall of the interconnect material contacts the mounting pad at an angle less than about 30 degrees from a plane perpendicular to the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.