Flexible interconnect structure for a sensor assembly
US9265142B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Mar 15, 2013 |
| Grant date | Feb 16, 2016 |
| Priority date | — |
| Expiry date | Feb 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple the differential sensor structure to an external component such as a circuit board, used to receive measurement information from the differential sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.