Hybrid integrated component

US9266720B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Johannes Classen · Reutlingen, DE
• Axel Franke · Ditzingen, DE
• Jens Frey · Echterdingen, DE
• Heribert Weber · Leverkusen, DE
• Frank Fischer · Pfaffen-Schwabenheim, DE
• Patrick Wellner · Neckartenzlingen, DE
• Mirko Hattass · Stuttgart, DE
• Daniel Christoph Meisel · Pittsburgh, US

Key dates

• Filing date: Oct 21, 2013
• Grant date: Feb 23, 2016
• Expiry date: Oct 21, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/48463
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap.