Patent · US Active

Eutectic bonding of thin chips on a carrier substrate

US9266721B2 · kind B2 · utility

1Cited by

1References

15Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Andreas Pruemm · Stuttgart, DE
Karl-Heinz Kraft · Stuttgart, DE
Thomas Mayer · Reutlingen, DE
Arnim Hoechst · Lörrach, DE
Christoph Schelling · Stuttgart, DE

Key dates

Filing date	Nov 23, 2010
Grant date	Feb 23, 2016
Priority date	—
Expiry date	Aug 16, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1579
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for producing a semiconductor component (166) is proposed. The method comprises the following steps:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.