Narrow-gap flip chip underfill composition
US9269596B2 · kind B2 · utility
1Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2013 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | Jan 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/186
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An underfill composition comprises a curable resin, a plurality of filler particles loaded within the resin, the filler particles comprising at least 50 weight % of the underfill composition. The filler particles comprise first filler particles having a particle size of from 0.1 micrometers to 15 micrometers and second filler particles having a particle size of less than 100 nanometers. A viscosity of the underfill composition is less than a viscosity of a corresponding composition not including the second filler particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.