Arjun Krishnan
17Patents
4h-index
19Co-inventors
57Inventor score
Filing activity: Jul 3, 1996 → Apr 26, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5924026A | Exchange of system and terminal capabilities over the same analog control channel | Electricity | 69 | Expired |
| US5826191A | Dual mode network call forwarding activation and deactivation | Electricity | 46 | Expired |
| US7043261B2 | System, mobile station and method for delivering services | Electricity | 18 | Expired |
| US7490341B2 | System and associated terminal, method and computer program product for directional channel browsing of broadcast content | Electricity | 5 | Active |
| US6381453B1 | Dual mode network call forwarding activation and deactivation | Electricity | 4 | Expired |
| US9620404B1 | Stiffener tape for electronic assembly that includes wafer or panel | Electricity | 2 | Active |
| US9631065B2 | Methods of forming wafer level underfill materials and structures formed thereby | Electricity | 1 | Active |
| US9330993B2 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Electricity | 1 | Active |
| US9269596B2 | Narrow-gap flip chip underfill composition | Electricity | 1 | Active |
| US8999765B2 | Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures | Electricity | 1 | Active |
| US8900919B2 | Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials | Electricity | 1 | Active |
| US10115606B2 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Electricity | 0 | Active |
| US9704767B1 | Mold compound with reinforced fibers | Electricity | 0 | Active |
| US9230833B2 | Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures | Electricity | 0 | Active |
| US9640415B2 | Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials | Electricity | 0 | Active |
| US9611372B2 | Narrow-gap flip chip underfill composition | Electricity | 0 | Active |
| US9793151B2 | Stiffener tape for electronic assembly | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.