Patent · US Active

Semiconductor device and method of manufacture thereof

US9269654B2 · kind B2 · utility

3Cited by

5References

22Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Stefan Willkofer · Munich, DE
Uwe Wahl · Munich, DE
Bernhard Knott · Dresden, DE
Markus Hammer · Neu-Ulm, DE
Andreas Strasser · Graz, AT

Key dates

Filing date	Feb 13, 2014
Grant date	Feb 23, 2016
Priority date	—
Expiry date	Apr 30, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4902
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device, a method of manufacturing a semiconductor device and a method for transmitting a signal are disclosed. In accordance with an embodiment of the present invention, the semiconductor device comprises a first semiconductor chip comprising a first coil, a second semiconductor chip comprising a second coil inductively coupled to the first coil, and an isolating intermediate layer between the first semiconductor chip and the second semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.