Substrate treating apparatus and substrate treating method
US9275852B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2013 |
| Grant date | Mar 1, 2016 |
| Priority date | — |
| Expiry date | Aug 28, 2034 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF26B21/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is an apparatus for treating a substrate using a supercritical fluid. The substrate treating apparatus includes a housing, a support member disposed within the housing to support the substrate, a supercritical fluid supply unit in which the supercritical fluid is stored, a supply tube connecting the supercritical fluid supply unit to the housing to adjust an amount of supercritical fluid supplied from the supercritical fluid supply unit into the housing, and a vent tube branched from the supply tube to discharge the supercritical fluid remaining in the supply tube. A switching valve opening or closing the vent tube is disposed in the vent tube.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.