Flip chip packages having chip fixing structures, electronic systems including the same, and memory cards including the same
US9275968B2 · kind B2 · utility
1Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2014 |
| Grant date | Mar 1, 2016 |
| Priority date | — |
| Expiry date | Oct 16, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip chip package includes a chip having a surface, main bumps disposed on a first region of the surface of the chip, dummy bumps disposed on a second region of the surface of the chip, a substrate having a surface, dams disposed on the surface of the substrate, connection pads disposed on the surface of the substrate and electrically connected to respective ones of the main bumps, and adhesion patterns attaching the dummy bumps to respective ones of the dams.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.