Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate
US9279663B2 · kind B2 · utility
0Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2012 |
| Grant date | Mar 8, 2016 |
| Priority date | — |
| Expiry date | Nov 17, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B2290/70
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.