CMP-friendly coatings for planar recessing or removing of variable-height layers
US9281192B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2014 |
| Grant date | Mar 8, 2016 |
| Priority date | — |
| Expiry date | May 13, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC device manufacturing process effectuates a planar recessing of material that initially varies in height across a substrate. The method includes forming a polymer coating, CMP to form a planar surface, then plasma etching to effectuate a planar recessing of the polymer coating. The material can be recessed together with the polymer coating, or subsequently with the recessed polymer coating providing a mask. Any of the material above a certain height is removed. Structures that are substantially below that certain height can be protected from contamination and left intact. The polymer can be a photoresist. The polymer can be provided with suitable adhesion and uniformity for the CMP process through a two-step baking process and by exhausting the baking chamber from below the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.