Inventor · Hsinchu, TW

Yu-Chung Su

20Patents
3h-index
27Co-inventors
59Inventor score

Filing activity: Mar 13, 2013 → Apr 14, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US9812358B1 FinFET structures and methods of forming the same Electricity 8 Active
US9281192B2 CMP-friendly coatings for planar recessing or removing of variable-height layers Electricity 5 Active
US9362120B2 Lithography process and composition with de-crosslinkable crosslink material Electricity 4 Active
US9436086B2 Anti-reflective layer and method Electricity 3 Active
US9245751B2 Anti-reflective layer and method Electricity 3 Active
US10082734B2 Composition and method for lithography patterning Electricity 2 Active
US10755927B2 Anti-reflective gap filling materials and methods Electricity 1 Active
US11120995B2 Method for forming multi-layer mask Electricity 1 Active
US9793268B2 Method and structure for gap filling improvement Electricity 1 Active
US9349622B2 Method and apparatus for planarization of substrate coatings Electricity 1 Active
US10768527B2 Resist solvents for photolithography applications Electricity 1 Active
US10770293B2 Method for manufacturing a semiconductor device Electricity 0 Active
US11500179B2 Imaging lens and electronic device having the same Physics 0 Active
US11094541B2 Anti-reflective coating materials Electricity 0 Active
US10163631B2 Polymer resin comprising gap filling materials and methods Electricity 0 Active
US11409084B2 Lens module including five lenses of −+++− refractive powers, and electronic device using the same Physics 0 Active
US10497574B2 Method for forming multi-layer mask Electricity 0 Active
US10515953B2 Method and structure for gap filling improvement Electricity 0 Active
US9761449B2 Gap filling materials and methods Electricity 0 Active
US12087616B2 Air gap formation method Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.