Image sensor that includes a boundary region formed between a logic circuit region and an image-sensing element region and manufacturing method thereof
US9281328B2 · kind B2 · utility
3Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2013 |
| Grant date | Mar 8, 2016 |
| Priority date | — |
| Expiry date | Feb 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/18
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, an image sensor includes an image-sensing element region formed by arranging a plurality of image-sensing elements on a semiconductor substrate and element isolation portions formed to isolate the image-sensing elements, and a logic circuit region formed in a region different from the image-sensing element region on the substrate and including a plurality of gate patterns. Further, dummy element isolation portions are arranged with a constant pitch in the boundary region between the image-sensing element region and the logic circuit region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.