Patent · US Active

Thermal compression bonding process cooling manifold

US9282650B2 · kind B2 · utility

9Cited by

13References

13Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Hemanth K. Dhavaleswarapu · Chandler, US
Zhihua Li · Changsha, CN
Joseph B. Petrini · Gilbert, US
Steven B. Roach · Gilbert, US
Shankar Devasenathipathy · Tempe, US
George Kostiew · Chandler, US
Amram Eitan · Scottsdale, US

Key dates

Filing date	Dec 18, 2013
Grant date	Mar 8, 2016
Priority date	—
Expiry date	Jan 20, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1121
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.