Dynamic heating method and system for wafer processing
US9287148B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2014 |
| Grant date | Mar 15, 2016 |
| Priority date | — |
| Expiry date | Dec 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6776
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method for dynamic heating of a workpiece during processing is disclosed. The system includes an ion source and a plurality of LEDs arranged in an array, which are directed at a portion of the surface of the workpiece. The LEDs are selected so that they emit light in a frequency range that is readily absorbed by the workpiece, thus heating the workpiece. In some embodiments, the LEDs heat a portion of the workpiece just before that portion is processed by an ion beam. In another embodiment, the LEDs heat a portion of the workpiece as it is being processed. The LEDs may be arranged in an array, which may have a width that is at least as wide as the width of the ion beam. The array also has a length, perpendicular to its width, having one or more rows of LEDs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.