Imaging sensor structure and method
US9287312B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2013 |
| Grant date | Mar 15, 2016 |
| Priority date | — |
| Expiry date | Mar 22, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/813
Abstract
The present disclosure provides an embodiment of a method for fabricating a three dimensional (3D) image sensor structure. The method includes providing to an image sensor substrate having image sensors formed therein and a first interconnect structure formed thereon, and a logic substrate having a logic circuit formed therein and a second interconnect structure formed thereon; bonding the logic substrate to the image sensor substrate in a configuration that the first interconnect structure and second interconnect structure are sandwiched between the logic substrate and the image sensor substrate; and forming a conductive feature extending from the logic substrate to the first interconnect structure, thereby electrically coupling the logic circuit to the image sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.