Inventor · Kaohsiung, TW

Feng-Chi Hung

136Patents
9h-index
68Co-inventors
79Inventor score

Filing activity: Feb 13, 2006 → Jul 21, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9728521B2 Hybrid bond using a copper alloy for yield improvement Electricity 201 Active
US9704827B2 Hybrid bond pad structure Electricity 27 Active
US8736006B1 Backside structure for a BSI image sensor device Electricity 16 Active
US9449914B2 Stacked integrated circuits with redistribution lines Electricity 16 Active
US9136298B2 Mechanisms for forming image-sensor device with deep-trench isolation structure Electricity 12 Active
US10515990B2 Semiconductor devices having reduced noise Electricity 11 Active
US9041206B2 Interconnect structure and method Electricity 9 Active
US10269768B2 Stacked integrated circuits with redistribution lines Electricity 9 Active
US9666624B2 Mechanisms for forming image-sensor device with deep-trench isolation structure Electricity 9 Active
US10038025B2 Via support structure under pad areas for BSI bondability improvement Electricity 8 Active
US9123615B2 Vertically integrated image sensor chips and methods for forming the same Electricity 7 Active
US9525001B2 Semiconductor device and manufacturing method thereof Electricity 7 Active
US10461109B2 Multiple deep trench isolation (MDTI) structure for CMOS image sensor Electricity 7 Active
US9455158B2 3DIC interconnect devices and methods of forming same Electricity 6 Active
US9006080B2 Varied STI liners for isolation structures in image sensing devices Electricity 6 Active
US10566374B2 Via support structure under pad areas for BSI bondability improvement Electricity 5 Active
US9871070B2 Voltage biased metal shielding and deep trench isolation for backside illuminated (BSI) image sensors Electricity 5 Active
US9666630B2 Semiconductor devices, methods of manufacturing thereof, and image sensor devices Electricity 5 Active
US9312294B2 Semiconductor devices, methods of manufacturing thereof, and image sensor devices Electricity 5 Active
US10038026B2 Bond pad structure for bonding improvement Electricity 5 Active
US8952497B2 Scribe lines in wafers Electricity 5 Active
US9666566B1 3DIC structure and method for hybrid bonding semiconductor wafers Electricity 5 Active
US7453127B2 Double-diffused-drain MOS device with floating non-insulator spacers Electricity 5 Expired
US9224770B2 Image sensor device and method Electricity 5 Active
US9287312B2 Imaging sensor structure and method Electricity 5 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.