Wafer processing method
US9293372B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2015 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | Jul 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/6834
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer has a substrate, a functional layer and division lines. The wafer is held on a chuck table with a protective member attached to the front side of the functional layer in contact with the chuck table. The height of the back side of the wafer is detected in a Z direction along each division line while moving the chuck table in an X direction. An X coordinate is recorded for each division line, as well as a corresponding Z coordinate. A cutting blade is positioned on the back side of the wafer and moved in the Z direction according to the recorded X and Z coordinates while moving the chuck table in the X direction to thereby form a cut groove having a depth not reaching the functional layer, with a part of the substrate left between the bottom of the cut groove and the functional layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.