Method for manufacturing a printed circuit board
US9295150B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 25, 2013 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | Oct 11, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a first, second, and third dielectric layers, and a first, second, and third trace layers. The first trace layer and the second trace layer are formed on opposite surfaces of the first dielectric layer. The second dielectric layer is formed on the second trace layer, a first blind hole is defined in the first surface and terminated at a position in the first dielectric layer, a first conductive via is formed in the first blind hole. A second blind hole is formed in the second dielectric layer and the first dielectric layer. A second conductive via is formed in the second blind hole. The third trace layer is electrically connected with the second conductive via. The first trace layer is electrically connected with the second trace layer through the first conductive via and the second conductive via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.