Polishing apparatus and polishing method
US9296083B2 · kind B2 · utility
0Cited by
24References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2013 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | May 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02024
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus including a membrane including a pressure chamber and being configured to hold a wafer; a polishing portion including a polish pad contacting a polish surface of the wafer when polishing the wafer; a monitoring portion monitoring a state of inflation of the pressure chamber; and a controller controlling polishing of the wafer by the polishing portion based on a result of monitoring by the monitoring portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.