Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package
US9299602B2 · kind B2 · utility
1Cited by
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25Claims
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Key dates
| Filing date | Dec 20, 2011 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Dec 20, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10515
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bumpless build-up layer (BBUL) integrated circuit package and method of manufacturing are presented. In some embodiments, the package-on-package (PoP) pads of the BBUL integrated circuit package has a surface finish that can be palladium, nickel-palladium, nickel-gold, nickel-palladium-gold, or palladium-nickel-palladium-gold. In some embodiments, the PoP pad surface finish can be formed using either an electroless or electrolytic process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.