Method and apparatus for liquid treatment of wafer-shaped articles
US9305770B2 · kind B2 · utility
5Cited by
8References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 8, 2014 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | Aug 8, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68714
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, a liquid dispenser for dispensing a treatment liquid onto a downwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and a gas dispenser for dispensing a gas within a gap defined between the downwardly-facing surface of the wafer-shaped article and an upper surface of the spin chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.