3D semiconductor apparatus for initializing channels
US9305909B2 · kind B2 · utility
2Cited by
1References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 3, 2014 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | Apr 3, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1443
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor apparatus includes a plurality of stack dies which are formed with a predetermined number of channels. The semiconductor apparatus also includes a base die configured to initialize a channel not electrically coupled with the stack dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.