Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9306254B1 · kind B1 · utility
25Cited by
158References
13Claims
0Family size
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Key dates
| Filing date | Mar 14, 2014 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | Mar 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/026
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.