Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US9306255B1 · kind B1 · utility
3Cited by
159References
16Claims
0Family size
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Key dates
| Filing date | Mar 14, 2014 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | Mar 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/00
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.