Methods for surface attachment of flipped active components
US9307652B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 14, 2014 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | Nov 14, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1039
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for selectively transferring active components from a source substrate to a destination substrate includes providing a source substrate having a process side including active components and a back side opposite the process side, the active components having respective primary surfaces including electrical connections thereon adjacent the process side and respective secondary surfaces opposite the primary surfaces and facing the back side; pressing a first stamp having first pillars protruding therefrom against the active components on the process side of the source substrate to adhere the respective primary surfaces of the active components including the electrical connections thereon to respective transfer surfaces of the first pillars; pressing a second stamp having second pillars protruding therefrom against the active components on the first pillars of the first stamp to adhere the respective secondary surfaces of the active components to respective transfer surfaces of the second pillars, wherein the respective transfer surfaces of the second pillars have greater adhesive strength than those of the first pillars; and pressing the second stamp including the active comp…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.