Micromechanical system and corresponding manufacturing method
US9309107B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2012 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Oct 20, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24851
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromechanical system is described having a substrate; a first micromechanical functional area, which is situated above the substrate; a second micromechanical functional area, which is situated above the first micromechanical functional area and is connected via a first weblike anchoring structure to the first micromechanical functional area; a third micromechanical functional area, which is situated above the second micromechanical functional area, and which has a first subarea and a second subarea; the first subarea being connected via a second weblike anchoring structure to the second micromechanical functional area; and the second subarea being mounted floating over the substrate by the first subarea. The invention also provides a method for manufacturing such a micromechanical system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.