Temperature triggering ejector mechanism for lock pin soldering type component
US9314861B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2014 |
| Grant date | Apr 19, 2016 |
| Priority date | — |
| Expiry date | May 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/176
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A temperature triggering ejector system for lock pin soldering type component is provided. There is provided a temperature triggering ejector system for a lock pin soldering type component, lock pins of said component are fixed in through holes of a circuit board and solder is filled in the through holes after soldering, said system comprising: an ejector that is located at one side of the circuit board that is opposed to said component, and has ejector pins aligned with the through holes of the circuit board and a cylinder that drives the ejector pins; a temperature sensor for sensing the temperature of said solder being heated; a controller for driving the ejector pins of the ejector within a solder melting temperature range based on the temperature sensed by the temperature sensor, to eject the lock pins of said component from said circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.