Interchangeable sputter gun head
US9318306B2 · kind B2 · utility
0Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2013 |
| Grant date | Apr 19, 2016 |
| Priority date | — |
| Expiry date | Jul 8, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/332
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In some embodiments, apparatus are provided that provide for flexible processing in both high productivity combinatorial (HPC) and full wafer modes. The apparatus allow for interchangeable functionality that includes deposition with different sizes of targets, plasma treatment, ion beam treatment, and in-situ metrology. The functional modules are designed so that the modules may be interchanged with minimal effort and reduced system downtime.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.