Patent · US Active

Etching device and a method for etching a material of a workpiece

US9318358B2 · kind B2 · utility

0Cited by

1References

21Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Fischer · Umkirch, DE
Raimund Foerg · Straubing, DE
Sebastian Bernrieder · Regensburg, DE
Michael Larisch · Regensburg, DE

Key dates

Filing date	Apr 28, 2011
Grant date	Apr 19, 2016
Priority date	—
Expiry date	Dec 6, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67075
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An etching device is provided, the etching device including a process chamber including an etchant, a structure configured to provide a laminar flow of the etchant, and a workpiece handler configured to move a workpiece through the laminar flow of the etchant along a predefined track.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.