Apparatus and methods for through substrate via test
US9318394B2 · kind B2 · utility
3Cited by
16References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2014 |
| Grant date | Apr 19, 2016 |
| Priority date | — |
| Expiry date | Oct 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.