Power line structure for semiconductor apparatus
US9318435B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2014 |
| Grant date | Apr 19, 2016 |
| Priority date | — |
| Expiry date | Apr 2, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1434
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor apparatus has one or more semiconductor chips. The semiconductor apparatus may include a power supply pad; power lines disposed on one side of the power supply pad, and including a first power line and a second power line; and connection lines connecting the power supply pad and the power lines. The connection lines may include a plurality of first connection lines connecting the power supply pad and the first power line, and a plurality of second connection lines connecting the power supply pad and the second power line, and disposed between the first connection lines. One or more pair of adjacent first connection lines may have a connection part by which the pair of adjacent first connection lines are connected with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.