Metal deposition on substrates
US9318446B2 · kind B2 · utility
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2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2014 |
| Grant date | Apr 19, 2016 |
| Priority date | — |
| Expiry date | Mar 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various techniques, methods, devices and apparatus are provided where an isolation layer is provided at a peripheral region of the substrate, and one or more metal layers are deposited onto the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.