Michael Knabl
8Patents
2h-index
27Co-inventors
47Inventor score
Filing activity: Jul 23, 2012 → Nov 22, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8841768B2 | Chip package and a method for manufacturing a chip package | Electricity | 5 | Active |
| US11211459B2 | Semiconductor device and method of manufacturing a semiconductor device | Electricity | 4 | Active |
| US10580753B2 | Method for manufacturing semiconductor devices | Electricity | 2 | Active |
| US9318446B2 | Metal deposition on substrates | Electricity | 0 | Active |
| US11990520B2 | Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structures | Electricity | 0 | Active |
| US11515264B2 | Method for processing a semiconductor wafer, semiconductor composite structure and support structure for semiconductor wafer | Electricity | 0 | Active |
| US9698106B2 | Metal deposition on substrates | Electricity | 0 | Active |
| US11610817B2 | Method of processing a semiconductor wafer, semiconductor wafer, and semiconductor die produced from a semiconductor wafer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.