Method for embedding controlled-cavity MEMS package in integration board
US9321631B2 · kind B2 · utility
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2References
9Claims
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Key dates
| Filing date | Sep 19, 2014 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Sep 19, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for fabricating a micro-electro-mechanical system (MEMS) provides a semiconductor chip having a cavity with a radiation sensor MEMS. The opening of the cavity at the chip surface is covered by a plate transmissive to the radiation sensed by the MEMS. A patterned metal film is placed across the plate surface remote from the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.