Method for producing a substrate holder
US9321636B2 · kind B2 · utility
1Cited by
3References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2012 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Aug 19, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing a holder of at least one substrate from a first and a second plate, each including first and second parallel flat faces, the method including: a) delimitation on the first face of the second plate of plural surfaces by a non-bondable area in which a direct bonding with a face of the first plate is prevented; b) bringing the first face of the second plate into contact with the first face of the first plate; c) direct bonding between the first faces except in the non-bondable area; and d) removal of the portions of the second plate located vertically below surfaces inside the non-bondable area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.