Semiconductor fabrication component retuning
US9323244B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2013 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Nov 6, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Among other things, one or more systems and techniques for retuning a semiconductor fabrication component are provided. The semiconductor fabrication component, such as an advanced process control (APC) component, is configured to evaluate or adjust various fabrication parameters associated with semiconductor fabrication processing. Processing data associated with the semiconductor fabrication component is evaluated to formulate performance indices used to evaluate performance of parameters used by the semiconductor fabrication component. One or more fabrication process change simulations are performed to generate a component operating behavior data structure indicating how different values for the parameters result in improved or degraded performance by the semiconductor fabrication component. In this way, the component operating behavior data structure is evaluated to identify tuning values for the parameters that are used to retune the semiconductor fabrication component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.