Inventor · Hsinchu, TW

Keung Hui

11Patents
3h-index
14Co-inventors
49Inventor score

Filing activity: Oct 13, 2008 → Aug 10, 2015

Most-cited inventions

PatentTitleAreaCited byStatus
US8309444B2 System and method of dosage profile control Electricity 7 Active
US8295965B2 Semiconductor processing dispatch control Emerging Cross-Sectional Technologies 7 Active
US9102033B2 Apparatus and method for target thickness and surface profile uniformity control of multi-head chemical mechanical polishing process Electricity 4 Active
US9158301B2 Semiconductor processing dispatch control Emerging Cross-Sectional Technologies 3 Active
US10096482B2 Apparatus and method for chemical mechanical polishing process control Electricity 1 Active
US9132523B2 Chemical mechanical polish process control for improvement in within-wafer thickness uniformity Performing Operations; Transporting 1 Active
US8781614B2 Semiconductor processing dispatch control Emerging Cross-Sectional Technologies 1 Active
US9323244B2 Semiconductor fabrication component retuning Emerging Cross-Sectional Technologies 0 Active
US8129279B2 Chemical mechanical polish process control for improvement in within-wafer thickness uniformity Performing Operations; Transporting 0 Active
US8294124B2 Scanning method and system using 2-D ion implanter Electricity 0 Active
US8925479B2 System and method of dosage profile control Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.