Solder attach apparatus and method
US9324680B2 · kind B2 · utility
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18Claims
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Assignee
Inventor
Key dates
| Filing date | Sep 19, 2013 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Jun 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3436
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device including a solder structure and methods of forming an electrical interconnection are shown. Solder structures are shown including a solder ball formed from a first solder having a first melting temperature, and a connecting structure coupling the solder ball to one or more electrical connection pads, the connecting structure formed from a second solder having a second melting temperature lower than the first melting temperature. Electronic devices are shown including a polymer mold material formed over the solder structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.